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AssigneeSony Corporation
InventorsRena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
Estimating the term…
Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
A solid-state imaging device, comprising:
The solid-state imaging device according to claim 4, wherein
A method of manufacturing a solid-state imaging device including a plurality of pixels arranged in a matrix pattern, each of the pixels having a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate and a plurality of on-chip lenses arranged for every other pixel, the on-chip lenses being larger in size than the pixels, the method comprising
An electronic apparatus, comprising
Dependencies are inferred from the claim text.