US 2015/0084090 A1Published application

Mounting substrate and light emitting device

AssigneeMurata Manufacturing Co., Ltd.

InventorsMasakazu FUKUMITSU, Yoshiharu YOSHII

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Abstract

External connection conductors are arranged on a back surface of a base material, and wiring conductors are arranged on a front surface. An insulating layer is provided on surfaces of the wiring conductors. Component mounting conductors are provided on a surface of the insulating layer. The component mounting conductor and the wiring conductor are electrically coupled to each other, and the component mounting conductor and the wiring conductor are electrically coupled to each other. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between forming areas of the component mounting conductors. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between the forming areas of the component mounting conductors.

Claims7

Dependent claims

A mounting substrate comprising:

a base material shaped like a flat plate having a first surface and a second surface opposed to the first surface;
first and second component mounting conductors provided at a distance from each other on the first surface of the base material;
first and second external connection conductors provided at a distance from each other on the second surface of the base material;
a first wiring conductor disposed between the first surface of the base material and the first component mounting conductor, and shaped such as to be in contact with the first component mounting conductor and such as to avoid contact with the second component mounting conductor,
a second wiring conductor disposed between the first surface and the second component mounting conductor, and shaped such as to be in contact with the second component mounting conductor and such as to avoid contact with the first component mounting conductor;
an insulating layer disposed between the first and second wiring conductors and the first and second component mounting conductors such that center areas of the first and second wiring conductors are exposed therefrom;
a first conductive hole open at one end between the first component mounting conductor and the second component mounting conductor on the first surface of the base material and being in contact at the other end with the first external connection electrode;
and
a second conductive hole open at one end between the first component mounting conductor and the second component mounting conductor on the first surface of the base material and being in contact at the other end with the second external connection electrode,
wherein the first wiring conductor and the second wiring conductor partly project as projecting portions in a direction to approach each other,
wherein the first conductive hole penetrates the projecting portion of the first wiring conductor, and
wherein the second conductive hole penetrates the projecting portion of the second wiring conductor.

9 more elements

A mounting substrate comprising:

a base material shaped like a flat plate having a first surface and a second surface opposed to the first surface;
first and second component mounting conductors provided at a distance from each other on the first surface of the base material;
first and second external connection conductors provided at a distance from each other on the second surface of the base material;
a first wiring conductor disposed between the second surface of the base material and the first external connection conductor, and shaped such as to be in contact with the first external connection conductor and such as to avoid contact with the second external connection conductor;
a second wiring conductor disposed between the second surface and the second external connection conductor, and shaped such as to be in contact with the second external connection conductor and such as to avoid contact with the first external connection conductor;
an insulating layer disposed between the first and second wiring conductors and the first and second external connection conductors such that center areas of the first and second wiring conductors are exposed therefrom;
a first conductive hole open at one end between the first external connection conductor and the second external connection conductor on the second surface of the base material, being in contact at the other end with the first component mounting electrode, and being connected to the first wiring electrode at an intermediate position between the one end and the other end;
and
a second conductive hole open at one end between the first external connection conductor and the second external connection conductor on the second surface of the base material, being in contact at the other end with the second component mounting electrode, and being connected to the second wiring conductor at an intermediate position between the one end and the other end,
wherein the first wiring conductor and the second wiring conductor partly project as projecting portions in a direction to approach each other,
wherein the first conductive hole penetrates the projecting portion of the first wiring conductor, and
wherein the second conductive hole penetrates the projecting portion of the second wiring conductor.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/556,404Filed 1 Dec 2014
Priority: JP 2012-14278626 Jun 2012
Published: 26 Mar 2015
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

H10W 42/60
Arrangements for protection of devices: protecting against electrostatic charges or discharges, e.g. Faraday shields
H05F 3/00
Carrying-off electrostatic charges
H05K 3/421
Plated through-holes or plated via connections: blind plated via connections
H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls