Semiconductor device and imaging device
AssigneeKabushiki Kaisha Toshiba
InventorsShintaro NAKANO, Tomomasa UEDA, Kentaro MIURA, Nobuyoshi SAITO, Tatsunori SAKANO, Yuya MAEDA, Masaki ATSUTA, Hajime YAMAGUCHI
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AssigneeKabushiki Kaisha Toshiba
InventorsShintaro NAKANO, Tomomasa UEDA, Kentaro MIURA, Nobuyoshi SAITO, Tatsunori SAKANO, Yuya MAEDA, Masaki ATSUTA, Hajime YAMAGUCHI
Estimating the term…
According to one embodiment, a semiconductor device includes a semiconductor layer including a first semiconductor portion and a second semiconductor portion being continuous with the first semiconductor portion, a first gate electrode, a second gate electrode, an insulating film. The first semiconductor portion includes a first portion, a second portion and a third portion provided between the first portion and the second portion. The second semiconductor portion includes a fourth portion separated from the first portion, a fifth portion separated from the second portion, and a sixth portion provided between the forth portion and the fifth portion. The first gate electrode is separated from the third portion. The second gate electrode is separated from the sixth portion. The insulating film is provided at a first position between the first gate electrode and the semiconductor layer and at a second position between the second gate electrode and the semiconductor layer.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.