Vertical led chip package on tsv carrier
AssigneeTSMC Solid State Lighting Ltd.
InventorChung Yu Wang
Life of this patent
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Abstract
A light-emitting device (LED) package component includes a carrier wafer. The carrier wafer includes a first through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. A light-emitting device (LED) is bonded onto the carrier wafer. The LED are electrically connected to the first TSV. A conductive thermal interface material (TIM) is located between, and adjoining, the first TSV and the LED.
Claims20
A light-emitting device (LED) package component, comprising:
- a carrier substrate;
- a plurality of through-substrate vias (TSVs) extending through the carrier substrate from a first surface of the carrier substrate to a second surface of the carrier substrate, the TSVs including a first TSV and one or more second TSVs;
- a light-emitting device (LED) bonded to the first surface of the carrier wafer;
- and
- a conductive thermal interface material (TIM) disposed between the LED and the first surface of the carrier wafer.
A light-emitting device (LED) package component, comprising:
- a carrier wafer, wherein the carrier wafer is a semiconductor wafer, a silicon wafer, or a dielectric wafer;
- a plurality of through-substrate vias (TSVs) extending through the carrier wafer from a first side of the carrier wafer to a second side of the carrier wafer, the TSVs including a plurality of first TSVs and a plurality of second TSVs;
- a plurality of light-emitting devices (LEDs) bonded to the first side of the carrier wafer through a conductive thermal interface material (TIM), wherein the LEDs are each free of a sapphire substrate;
- and
- a silicone lens molded onto each of the LEDs.
A light-emitting device (LED) package component comprising:
- a carrier wafer comprising a first through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer;
- a light-emitting device (LED) bonded onto the carrier wafer, with the LED being electrically connected to the first TSV;
- and
- a conductive thermal interface material (TIM) between, and adjoining, the first TSV and the LED.
Dependencies are inferred from the claim text.