Thermal-contraction matched hybrid device package

A hybrid focal plane array (FPA) device package, comprising:

• a baseplate comprising alumina;
• a balanced composite structure (BCS) on said baseplate, said BCS comprising:
• a balancing layer on said baseplate;
• and
• a compressive layer on said balancing layer;
• a readout integrated circuit (ROIC) on said BCS, said BCS and said ROIC forming a BCS/ROIC stack;
• a detector array IC physically coupled to said ROIC, said detector array IC having an associated operating temperature;
• and
• an electrical interface board to which said ROIC and said detector IC can be electrically connected, said electrical interface board forming a portion of a monolithic structure with said baseplate;
• said FPA device package arranged such that the coefficient of thermal expansion (CTE) of said BCS/ROIC stack is approximately equal to that of said baseplate, thereby reducing the thermal stress to which said detector array IC is subjected when cooled to its operating temperature which might otherwise result in physical damage to said detector array IC.