Substrate Bonding Apparatus and Substrate Bonding Method

A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising:

• a joining section that joins the first substrate and the second substrate together aligned to each other;
• a detecting section that detects an uneven state on at least one of the first substrate and the second substrate prior to joining by the joining sections;
• and
• a determining section that determines whether the first substrate and the second substrate can be joined in the joining sections in a predetermined joining condition, based on the uneven state detected by the detecting section.

A substrate bonding apparatus comprising:

• an aligning section that aligns a first substrate and second substrate together;
• a detecting section which detects an uneven state on at least one of the first substrate and the second substrate;
• and
• a determining section that determines whether aligning in the aligning section is possible, based on the uneven state detected by the detecting section.

A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising:

• a stacking section that stacks the first substrate and the second substrate together aligned to each other;
• a detecting section that detects an uneven state on at least one of the first substrate and the second substrate;
• and
• a determining section that determines whether the uneven state is in a predetermined state due to weight applied to at least one of the first substrate and the second substrate in stacking in the stacking section, based on the uneven state detected by the detecting section.

A substrate bonding method that bonds a first substrate and a second substrate together, comprising:

• joining of joining the first substrate and the second substrate together aligned to each other;
• detection of detecting an uneven state on at least one of the first substrate and the second substrate prior to the joining;
• and
• determination of determining whether the first substrate and the second substrate can be joined under a predetermined joining condition in the joining, based on the uneven state detected by the detection.

A substrate bonding method comprising:

• aligning of aligning a first substrate and a second substrate together;
• detection of detecting an uneven state on at least one of the first substrate and the second substrate;
• and
• determination of determining whether aligning in the aligning is possible, based on the uneven state detected in the determination.

A substrate bonding method comprising:

• stacking of stacking a first substrate and a second substrate together aligned to each other;
• detection of detecting an uneven state on at least one of the first substrate and the second substrate;
• and
• determination of determining whether the uneven state is in a predetermined state due to weight applied to at least one of the first substrate and the second substrate in stacking in the stacking.