Back to results
US 2015/0083473 A1Published application
Flexible electronic fiber-reinforced composite materials
AssigneeCubic Tech Corporation
InventorsRoland Joseph Downs, Heiner W. Meldner, Christopher Michael Adams
Life of this patent
Estimating the term…
Abstract
Flexible electronic substrate systems relating to providing a system for dimensionally-stable substrate systems to support electronic systems is provided.
Claims20
A composite material for electronic applications comprising:
- a. at least one conductive layer;
- and
- b. at least one laminate layer bonded to said conductive layer and comprising at least one unidirectional tape layer comprising monofilaments coated in an adhesive, all of said monofilaments lying in a predetermined direction within said tape,
- wherein said monofilaments have diameters less than 20 microns, and wherein spacing between individual monofilaments within an adjoining strengthening group of monofilaments is within a gap distance in the range between non-abutting monofilaments up to nine times the monofilament major diameter.
1 more element
A method of manufacturing an electronic composite material, said method comprising:
- (a) providing a laminate layer comprising at least one unidirectional tape layer comprising parallel monofilaments coated in an adhesive, all of said monofilaments thinly spread in a predetermined direction;
- and
- (b) printing, depositing, or bonding a conductive layer onto said laminate layer.
Dependencies are inferred from the claim text.