Wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorsMasahiro SUNOHARA, Yuichiro SHIMIZU
Life of this patent
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Abstract
A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring formed in the through hole and including a first metal layer formed on a part of an inner side surface of the through hole at the one surface side, a first wiring layer that covers the first metal layer to fill a part of the through hole at the one surface side, a second metal layer continuously formed on the rest part of the inner side surface of the through hole at the other surface side and on an end portion of the first wiring layer at the other surface side, and a second wiring layer that covers the second metal layer to fill a part of the through hole at the other surface side.
Claims6
A wiring board comprising:
- a substrate body provided with a through hole penetrating the substrate body from one surface to another surface of the substrate body;
- and
- a through wiring formed in the through hole and including
- a first metal layer that is formed on a part of an inner side surface of the through hole at the one surface side,
- a first wiring layer that covers the first metal layer to fill a part of the through hole at the one surface side,
- a second metal layer that is continuously formed on the rest part of the inner side surface of the through hole at the other surface side and on an end portion of the first wiring layer at the other surface side, and
- a second wiring layer that covers the second metal layer to fill a part of the through hole at the other surface side, the first wiring layer and the second wiring layer being electrically connected in the through hole via the second metal layer.
Dependencies are inferred from the claim text.