Transparent body for use in a touch screen panel manufacturing method and system

A transparent body adapted for use in a touch screen panel comprising:

• a transparent substrate;
• a transparent layer stack deposited over the transparent substrate, wherein said transparent layer stack is selected from the group consisting of:
• a layer stack, wherein the layer stack includes a first dielectric film with a gradient refractive index from a first refractive index to a second refractive index different from the first refractive index, and a layer stack, wherein the layer stack includes at least a first dielectric film with a first refractive index and a second dielectric film with a second refractive index different from the first refractive index;
• a transparent conductive film deposited over the transparent substrate, wherein the structured transparent conductive film corresponds to a sheet resistance of 100 Ohm/square or below;
• and
• a transparent adhesive deposited over the transparent conductive film and being configured for attaching the transparent body to the adjacent components of the touch screen panel.

A deposition apparatus for manufacturing a transparent body for use in a touch screen panel, said apparatus comprising:

• a first deposition assembly configured to deposit a first transparent layer stack over a substrate , said first transparent layer stack including at least first dielectric film with a first refractive index, and a second dielectric film with a second refractive index different from the second the first refractive index;
• a second deposition assembly configured to deposit a transparent conductive film;
• and
• means for providing a transparent conductive adhesive over the structured transparent conductive film, wherein said first deposition assembly and said second deposition assembly are arranged such that the first transparent layer stack and the transparent conductive film are disposed over the substrate in this order, and wherein at least one of the first deposition assembly or the second deposition assembly comprises a sputtering system operatively coupled to a target, said sputtering system being configured to deposit at least one of the first dielectric film, the second dielectric film, or the transparent conductive film by sputtering of the target.