Method of bonding and debonding substrate
AssigneeAu Optronics Corporation
InventorsShuo-Yang SUN, Wan-Chen HUANG, Wei-Ting LIN, Chun-Cheng CHENG
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Abstract
A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.
Claims13
A substrate bonding and debonding method, comprising:
- providing a substrate having a peel-off region and a peripheral region surrounding the peel-off region;
- forming a first silicone glue layer on the peel-off region of the substrate and forming a second silicone glue layer on the peripheral region of the substrate, wherein each of the first silicone glue layer and the second silicone glue layer includes an identical silicone main agent and an identical silicone curing agent, the volume ratio of the silicone main agent to the silicone curing agent of the first silicone glue layer is about 12:1 to about 15:1, and the volume ratio of the silicone main agent to the silicone curing agent of the second silicone glue layer is about 1:1 to about 5:1;
- adhering an opposite substrate to the first silicone glue layer and the second silicone glue layer;
- curing the first silicone glue layer and the second silicone glue layer to bond the substrate to the opposite substrate;
- and
- separating a portion of the substrate from the opposite substrate.
Dependencies are inferred from the claim text.