Manufacture of multijunction solar cell devices

A multi-junction solar cell device obtainable by the method comprising the following steps:

• providing a first engineered substrate;
• providing a second substrate;
• forming at least one first solar cell layer on the first engineered substrate to obtain a first wafer structure;
• forming at least one second solar cell layer on the second substrate to obtain a second wafer structure;
• bonding the first wafer structure to the second wafer structure;
• detaching the first engineered substrate;
• removing the second substrate;
• and
• bonding a third substrate to the at least one first solar cell layer.

An intermediate semiconductor substrate, comprising:

• a first substrate comprising InP;
• a first solar cell layer, a second solar cell layer, a third solar cell layer, and a fourth solar cell layer disposed in this sequence on the first substrate, wherein the first solar cell layer comprises GaInAs, and/or the second solar cell layer comprises GaInAsP, and/or the third solar cell layer comprises GaAs, and/or the fourth solar cell layer comprises GaInP;
• and
• a handling substrate comprising a glass material disposed on the fourth solar cell layer.

A method for manufacturing a multi-junction solar cell device comprising the steps of:

• providing a first engineered substrate;
• providing a second substrate;
• forming at least one first solar cell layer on the first engineered substrate to obtain a first wafer structure;
• forming at least one second solar cell layer on the second substrate to obtain a second wafer structure;
• bonding a handling substrate to the second wafer structure at the at least one second solar cell layer;
• detaching the second substrate to obtain a third wafer structure, wherein the detachment is performed by etching and/or grinding and followed by thinning by polishing;
• bonding the third wafer structure to the first wafer structure at the at least one first solar cell layer and the at least one second solar cell layer;
• detaching the first engineered substrate to obtain a fourth wafer structure;
• bonding the fourth wafer structure at the at least one first solar cell layer to a final substrate;
• and
• detaching the handling substrate.

A method for manufacturing a multi-junction solar cell device comprising the steps of:

• providing a first substrate comprising a bulk InP substrate;
• providing a second engineered substrate comprising a sapphire substrate including a zipper layer, wherein the second engineered substrate comprises a GaAs seed layer;
• forming at least a first solar cell layer on the first substrate to obtain a first wafer structure;
• forming at least a second solar cell layer on the seed layer to obtain a second wafer structure;
• bonding the first wafer structure and the second wafer structure at the at least one first solar cell layer and the at least one second solar cell layer to obtain a bonded structure;
• detaching the first substrate from the bonded structure;
• detaching the second engineered substrate;
• and
• bonding a third substrate to the at least one first solar cell layer.