Substrate treatment method and substrate treatment apparatus

A substrate treatment apparatus comprising:

• a substrate holding unit which holds a substrate;
• a substrate rotating unit which rotates the substrate held by the substrate holding unit;
• a chemical liquid supplying unit which supplies a chemical liquid to a front surface of the substrate being rotated by the substrate rotating unit;
• a rinse liquid supplying unit which supplies a rinse liquid to the front surface of the substrate being rotated by the substrate rotating unit;
• and
• a control unit which controls the substrate rotating unit, the chemical liquid supplying unit and the rinse liquid supplying unit to perform a chemical liquid step of supplying the chemical liquid to the front surface of the substrate while rotating the substrate at a predetermined rotation speed to treat the front surface of the substrate, and a rinsing step of supplying the rinse liquid to the front surface of the rotating substrate after the chemical liquid step to rinse away the chemical liquid from the front surface of the substrate and form a liquid film of the rinse liquid;
• wherein the rinsing step includes a higher-speed rinsing step and a deceleration rinsing step to be performed after the higher-speed rinsing step;
• wherein, in the deceleration rinsing step, the control unit performs a liquid puddling step of reducing the rotation speed of the substrate within a rotation speed range lower than a rotation speed employed in the higher-speed rinsing step and supplying the rinse liquid to the front surface of the substrate at a flow rate higher than a maximum supply flow rate employed in the higher-speed rinsing step, whereby the rinse liquid film is formed in a puddle-like form on the front surface of the substrate.