Method for simultaneously cutting a multiplicity of wafers from a workpiece

2:

• The method as recited in claim 1, wherein the wire sections exhibit constant bending in the feed direction when the workpiece is moved through the wire web.

3:

• The method as recited in claim 1, wherein the wire sections exhibit variable bending in the feed direction when the cut-in beam foot end is moved through the wire web.

4:

• The method as recited in claim 3, wherein the foot end is moved through the wire web such that the bending of the wire sections assumes a maximum which is no longer achieved in the further course of the cutting process.

5:

• The method as recited in claim 1, wherein an adhesive is used to bond the head end of the cut-in beam into the notch when applying the cut-in beam on the workpiece.

6:

• The method as recited in claim 1, wherein the cut-in beam has a height, between the head end and the foot end, which is constant between the front side and the rear side.

7:

• The method as recited in claim 1, wherein the cut-in beam is in the shape of a circular cylinder.

8:

• The method as recited in claim 1, wherein the shape of the cross section of the foot end varies between the front side and the rear side in the feed direction, such that the wire sections cut into the cut-in beam with decreasing engagement lengths.

9:

• The method as recited in claim 8, wherein the shape of the cross section of the foot end becomes increasingly wedge-shaped between the front side and the rear side in the feed direction.

10:

• The method as recited in claim 1, wherein the cut-in beam has a height, between the head end and the foot end, which decreases between the front side and the rear side, such that the wire sections cut commensurately later into the cut-in beam the longer the wire path between the wire sections and a start of the wire web.

11:

• The method as recited in claim 1, further comprising conducting a test cut where the cut-in beam is obviated and the maximum depth of cut-in waves in the wafers is determined,

12:

• The method as recited in claim 11, wherein the height of the foot end is equal to or greater than the maximum depth determined.

13:

• The method as recited in claim 1, wherein the side of the cut in beam side has grooves lying opposite the wire web, the grooves being arranged perpendicularly over the wire sections.

14:

• The method as recited in 12, wherein the grooves are arranged perpendicularly over the wire sections after a position displacement of the wire sections in the direction of the axes of the wire guide rollers, caused by thermal expansion at the operating temperature.