Strain sensor
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorHIDEO OHKOSHI
Life of this patent
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Abstract
A strain sensor includes a package to be connected to a strain generating body, a detector configured to convert a mechanical strain of the strain generating body into an electric signal and output the electric signal, and a processor chip connected to an upper surface of the package and separated from a detector. A recess is provided in the upper surface of the package. The detector is accommodated in the recess and joined to the recess. This strain sensor can have a small size.
Claims13
A strain sensor to detect a mechanical strain of a strain generating body, the strain sensor comprising:
- a package having an upper surface and a lower surface, the upper surface having a recess formed therein, the lower surface being connected to the strain generating body;
- a detector accommodated in the recess and joined to the recess, the detector converting the mechanical strain into an electric signal and outputting the electric signal;
- and
- a processor chip connected to the upper surface of the package and separated from the detector, the processor chip configured to process the electric signal output from the detector.
A strain sensor to detect a mechanical strain of a strain generating body, the strain sensor comprising:
- a package having an upper surface and a lower surface, the upper surface having a recess therein, the lower surface connected to the strain generating body;
- a detector accommodated in the recess and joined to the recess, the detector converting the mechanical strain into an electric signal and outputting the electric signal;
- and
- a processor chip connected to the upper surface of the package and separated from the detector, the processor chip processing the electric signal output from the detector,
- wherein the detector is joined to the recess with a thermosetting conductive adhesive that includes a spacer or with a first bump having a core and a solder that covers at least a part of a surface of the core, and
- wherein the processor chip is electrically and mechanically connected to the upper surface of the package with a second bump that includes a thermosetting conductive adhesive.
Dependencies are inferred from the claim text.