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US 2015/0082811 A1Published application
Adaptive Thermoelectric Cooling In A Processor
AssigneeIntel Corporation
InventorsThanunathan Rangarajan, Rahul Khanna, Richard Marian Thomaiyar, Minh T. Le
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Abstract
In an embodiment, a processor includes a thermoelectric cooling (TEC) controller to obtain a platform cooling level associated with the processor; obtain a temperature associated with the processor; calculate a TEC power level based at least in part on the platform cooling level and the temperature; and provide the TEC power level to a TEC device associated with the processor, wherein the TEC device is to transfer heat from the processor to a heat sink. Other embodiments are described and claimed.
Claims20
A processor comprising:
- a thermoelectric cooling (TEC) controller to:
- obtain a platform cooling level associated with the processor;
- obtain a temperature associated with the processor;
- calculate a TEC power level based at least in part on the platform cooling level and the temperature;
- and
- provide the TEC power level to a TEC device associated with the processor, wherein the TEC device is to transfer heat from the processor to a heat sink.
3 more elements
A processor comprising:
- a plurality of cores to execute a plurality of instructions;
- a first thermoelectric cooling (TEC) device to provide localized cooling to a first core of the plurality of cores;
- logic to determine a predicted heat load on the first core associated with executing a first portion of the plurality of instructions;
- and
- a TEC controller to control, based on the predicted heat load, a power level of the first TEC device when the first core is executing the first portion of the plurality of instructions.
2 more elements
A method, comprising:
- determining a current level of a platform cooling device;
- determining a temperature of an electronic device;
- calculating, based at least on the current level and the temperature, a power level for a thermoelectric cooling (TEC) device, wherein the TEC device is to transfer heat from the electronic device to the platform cooling device.
Dependencies are inferred from the claim text.