Methods for modifying an integrated circuit layout design
AssigneeGlobalfoundries Inc.
InventorAyman Hamouda
Life of this patent
Estimating the term…
Abstract
Methods for modifying a layout design of an integrated circuit are provided. In one embodiment, a method for modifying an integrated circuit layout design includes providing an initial circuit layout design comprising a lower metal layer, an upper metal layer, and a first via electrically connecting the lower metal layer to the upper metal layer. The method further includes altering the initial circuit layout design by providing a second via, the second via being in electrical contact with no more than one of the upper metal layer and the lower metal layer, and the second via further being in proximity to the first via. Further, the method includes further altering the initial circuit layout design by providing a subresolution assist feature in proximity to the second via.
Claims20
A method for modifying an integrated circuit layout design, the method comprising:
- providing an initial circuit layout design comprising a lower metal layer, an upper metal layer, and a first via electrically connecting the lower metal layer to the upper metal layer;
- altering the initial circuit layout design by providing a second via, the second via being in electrical contact with no more than one of the upper metal layer and the lower metal layer, the second via further being in proximity to the first via;
- and
- further altering the initial circuit layout design by providing a subresolution assist feature in proximity to the second via.
A method for modifying an integrated circuit layout design, the method comprising:
- providing an initial multiple-patterned circuit layout design comprising a first pattern exposure and a second pattern exposure;
- modifying the initial multiple-patterned circuit layout design by providing a subresolution assist feature to the first pattern exposure;
- determining whether the presence of any overlapping areas between the subresolution assist feature of the first pattern exposure and the second pattern exposure;
- and
- further modifying the initial multiple-patterned circuit layout design by:
- maintaining the size of any portion of the subresolution assist feature in the overlapping areas;
- and
- shrinking the size of any portion of the subresolution assist feature that is not in the overlapping areas.
A system for modifying an integrated circuit layout design, the system comprising:
- a display device;
- a user input device;
- a storage device;
- and
- a processor electronically and communicatively coupled to the display device, the user input device, and the storage device and configured to perform the following procedures:
- provide an initial circuit layout design comprising a lower metal layer, an upper metal layer, and a first via electrically connecting the lower metal layer to the upper metal layer;
- alter the initial circuit layout design by providing a second via, the second via being in electrical contact with no more than one of the upper metal layer and the lower metal layer, the second via further being in proximity to the first via;
- and
- further alter the initial circuit layout design by providing a subresolution assist feature in proximity to the second via.
Dependencies are inferred from the claim text.