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US 2015/0031273 A1Published application
Pad conditioner and method of reconditioning planarization pad
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHui-Wen TING
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Abstract
A planarization device includes a planarization pad and a pad conditioner over the planarization pad. The pad conditioner includes a rotatable plate having a lower surface separated from an upper surface of the planarization pad by a predetermined distance and at least one nozzle opening on the lower surface of the rotatable plate.
Claims25
A planarization device, comprising:
- a planarization pad;
- and
- a pad conditioner over the planarization pad, the pad conditioner comprising:
- a rotatable plate having a lower surface separated from an upper surface of the planarization pad by a predetermined distance;
- and
- at least one nozzle opening on the lower surface of the rotatable plate.
3 more elements
A manufacture, comprising:
- a plate having a rotational center and a lower surface, the plate being rotatable about the rotational center;
- a driving unit configured to cause the rotatable plate to rotate according to a predetermined rotation-speed profile;
- and
- a plurality of nozzle openings on the lower surface of the rotatable plate.
1 more element
A method comprising:
- causing a rotatable plate of a pad conditioner to rotate;
- and
- dispensing a fluid material onto an upper surface of a planarization pad of a planarization device through nozzle openings disposed on a lower surface of the rotatable plate.
Dependencies are inferred from the claim text.