Composition for forming highly adhesive resist underlayer film

Abstract

A composition for forming a resist underlayer film for lithography, including a polymer having a repeating structural unit of Formula (1): R1 is a hydrogen atom or a methyl group and Q1 is a group of Formula (2) or Formula (3): (wherein R2, R3, R5, and R6 are independently a hydrogen atom or a linear or branched hydrocarbon group having a carbon atom number of 1 to 4, R4 is a hydrogen atom or a methyl group, R7 is a linear or branched hydrocarbon group having a carbon atom number of 1 to 6, a C1-4 alkoxy group, a C1-4 alkylthio group, a halogen atom, a cyano group, or a nitro group, w1 is an integer of 0 to 3, w2 is an integer of 0 to 2, and x is an integer of 0 to 3), and v1 and v2 are independently 0 or 1; and an organic solvent.

Dependencies are inferred from the claim text.