Substrate carrier arrangement, coating system having a substrate carrier arrangement and method for performing a coating process

Coating system for coating at least one substrate with a semiconductor material, comprising a coating chamber, in which a substrate carrier arrangement is arranged, wherein the substrate carrier arrangement comprises a carrier which comprises at least one support region having a support surface, on which a substrate support is arranged, and which support region comprises in the support surface at least one first and one second gas inlet, wherein the first gas inlet is at a smaller distance from a center (M) of the support surface than the second gas inlet and wherein the first and second gas inlet have mutually independent gas feeds which are arranged to supply gases having mutually different thermal conductivities.

Method for performing a coating process for coating a substrate with a semiconductor material,

• wherein a substrate carrier arrangement is used, the substrate carrier arrangement comprising a carrier which comprises at least one support region having a support surface, on which a substrate support is arranged, and which support region comprises in the support surface at least one first and one second gas inlet, wherein the first gas inlet is at a smaller distance from a center (M) of the support surface than the second gas inlet and wherein the first and second gas inlet have mutually independent gas feeds which are arranged to supply gases having mutually different thermal conductivities, and
• wherein through the at least one first gas inlet and the at least one second gas inlet gases having different thermal conductivities are supplied and form a gas cushion between the substrate support and the support surface, on which gas cushion the substrate support hovers over the support surface and which gas cushion has a varying thermal conductivity in dependence upon a distance from the center (M).