Methods of manufacturing a package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsiao-Tsung Yen, Min-Chie Jeng, Hsien-Pin Hu, Tzuan-Horng Liu, Chin-Wei Kuo, Chung-Yu Lu, Yu-Ling Lin
Life of this patent
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Abstract
A method of manufacturing a package may include: providing a first device having a first redistribution layer (RDL) and an insulator layer disposed over the first RDL; and forming a first micro-bump line over the insulator layer of the first device. The first micro-bump line may extend laterally over a surface of the insulator layer facing away from the first RDL, and a first inductor of the package comprises the first RDL and the first micro-bump line.
Claims20
A method of manufacturing a package, the method comprising:
- providing a first device having a first redistribution layer (RDL) and an insulator layer disposed over the first RDL;
- and
- forming a first micro-bump line over the insulator layer of the first device, the first micro-bump line extending laterally over a surface of the insulator layer facing away from the first RDL, wherein a first inductor of the package comprises the first RDL and the first micro-bump line.
A method of manufacturing a package, the method comprising:
- forming a first opening in a dielectric layer of a first device, the first opening exposing a first portion of a first redistribution layer (RDL) of the first device;
- forming a first contact pad in the first opening, the first contact pad electrically connected to the first RDL;
- and
- forming a micro-bump line over a surface of the dielectric layer of the first device, the micro-bump line having a first region disposed over and electrically connected to the first contact pad, wherein an inductor of the package comprises the micro-bump line, the first contact pad, and the first RDL.
A method of manufacturing a package, the method comprising:
- providing a first device comprising a passivation layer, a first redistribution layer (RDL) above the passivation layer, an insulator layer above the first RDL with an opening exposing the first RDL, and a first under bump metal (UBM) pad covering the opening of the insulator layer and connected to the first RDL;
- forming a first micro-bump line on the first UBM pad connected to the first RDL;
- and
- forming a first inductor comprising the first RDL and the first micro-bump line.
Dependencies are inferred from the claim text.