Method for interconnection of components on a substrate

Abstract

A method is described for interconnecting first, 27, and second, 22, components on a substrate, 21. The method comprises attaching said first component, 27, to said substrate, attaching said second component, 22, to said substrate, 21, said first and second components being positioned relative to each other on said substrate to form a gap, 31, therebetween. The method further comprises the step of depositing a layer, 24, of electrically insulating material in said gap, and electrically connecting said first component, 27, with said second component, 22, by depositing, upon said electrically insulating layer, a layer of electrically conducting material, 26, which is in contact with and extends from a surface of said first electronic component, across said gap, 31, and said layer of electrically insulating material, 24, and to a surface of said second electronic component, 22. The method is characterized in that a plasma deposition process is used to deposit at least one of said layers of material.

Dependencies are inferred from the claim text.