Plating method, plating system and storage medium
AssigneeTokyo Electron Limited
InventorsTakashi Tanaka, Yuichiro Inatomi, Nobutaka Mizutani, Yusuke Saito, Mitsuaki Iwashita
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Abstract
A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer 23a serving as a barrier film on a substrate 2; baking the first plating layer 23a; forming a second plating layer 23b serving as a barrier film; and baking the second plating layer 23b. A plating layer stacked body 23 serving as a barrier film is formed of the first plating layer 23a and the second plating layer 23b.
Claims15
A plating method of performing a plating process on a substrate, the plating method comprising:
- a substrate preparing process of preparing the substrate;
- a plating layer forming process of forming a plating layer having a preset function by performing the plating process on the substrate with a plating liquid;
- and
- a plating layer baking process of baking the plating layer by heating the substrate,
- wherein by repeating the plating layer forming process and the plating layer baking process at least twice, a plating layer stacked body having a first plating layer obtained through a first plating layer forming process and a first plating layer baking process and a second plating layer obtained through a second plating layer forming process and a second plating layer baking process is formed.
A plating system of performing a plating process on a substrate, the plating system comprising:
- a plating layer forming unit configured to form a plating layer having a preset function by performing the plating process on the substrate with a plating liquid;
- a plating layer baking unit configured to bake the plating layer by heating a base;
- a substrate transfer unit configured to transfer the substrate between the plating layer forming unit and the plating layer baking unit;
- and
- a controller configured to control the plating layer forming unit, the plating layer baking unit and the substrate transfer unit,
- wherein by repeating a plating layer forming process in the plating layer forming unit and a plating layer baking process in the plating layer baking unit at least twice, a plating layer stacked body having a first plating layer obtained through a first plating layer forming process and a first plating layer baking process and a second plating layer obtained through a second plating layer forming process and a second plating layer baking process is formed.
A computer-readable storage medium having stored thereon computer-executable instructions that, in response to execution, cause a plating system to perform a plating method,
- wherein the plating method comprises:
- a substrate preparing process of preparing a substrate;
- a plating layer forming process of forming a plating layer having a preset function by performing a plating process on the substrate with a plating liquid;
- and
- a plating layer baking process of baking the plating layer by heating the substrate,
- wherein by repeating the plating layer forming process and the plating layer baking process at least twice, a plating layer stacked body having a first plating layer obtained through a first plating layer forming process and a first plating layer baking process and a second plating layer obtained through a second plating layer forming process and a second plating layer baking process is formed.
Dependencies are inferred from the claim text.