Apparatus and process for producing fluorinated organosilicon compound thin film

Abstract

To provide an apparatus and process capable of continuously forming a fluorinated organosilicon compound thin film having high durability while a substrate is transported. An apparatus for producing a fluorinated organosilicon compound thin film, which comprises a chamber, a heating container for heating a deposition material, a plurality of nozzles for supplying the deposition material to a substrate, provided in the chamber and connected to the heating container, and a substrate transport mechanism for transporting the substrate, wherein the plurality of nozzles are arranged in a line so that they cross the direction of transport of the substrate, and a fluorinated organosilicon compound as the deposition material is one subjected to a solvent removal treatment or one not diluted; and a process for producing a fluorinated organosilicon compound thin film, which comprises heating a fluorinated organosilicon compound subjected to a solvent removal treatment or not diluted, in a heating container, supplying the deposition material from a plurality of nozzles arranged in a line so that they cross the direction of transport of the substrate, provided in a chamber and connected to the heating container, and forming a thin film on a surface of the substrate on which a thin film is to be formed, while the substrate is transported.

Dependencies are inferred from the claim text.