Substrate inspection method, substrate manufacturing method and substrate inspection device
AssigneeHoya Corporation
InventorMasaru TANABE
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AssigneeHoya Corporation
InventorMasaru TANABE
Estimating the term…
A method for inspecting a substrate having a plurality of holes formed on a plate-shaped material so as to extend over front and rear surfaces thereof. The method comprises picking-up an image of a plurality of holes formed on the substrate by imaging from one surface side of the substrate and obtaining a hole image of each hole (S103). Then, specifying a reference hole image of the plurality of holes from an imaging result obtained by the image acquisition step (S105). Thereafter, a similarity between each hole image, being the imaging result obtained by the image acquisition step is quantified and the reference hole image, is obtained by pattern matching processing using a specific correlative function (S105 to S107). Finally, a proper/improper hole shape of each of the plurality of holes is judged using a quantification result of each hole image obtained by the quantification step as an index (S108).
A substrate inspection method, for inspecting a substrate having a plurality of holes formed on a plate-shaped material so as to extend over front and rear surfaces of the plate-shaped material, comprising:
A substrate manufacturing method,
A substrate inspection device for inspecting a substrate having a plurality of holes formed on a plate-shaped material so as to extend over front and rear surfaces of the plate-shaped material, the device comprising:
Dependencies are inferred from the claim text.