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US 2015/0029774 A1Published application
Stacked device identification assignment
AssigneeMicron Technology, Inc.
InventorBrent Keeth
Life of this patent
Estimating the term…
Abstract
Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.
Claims1
An apparatus comprising:
- dice arranged in a stack, the dice including at least a first die and a second die;
- and
- a connection coupled to the dice and configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.
Dependencies are inferred from the claim text.