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US 2015/0029691 A1Published application
Device housing for receiving display module and manufacturing method
AssigneeFIH (Hong Kong) Limited
InventorSHIH-WEI YANG
Life of this patent
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Abstract
A device housing includes a housing body, a support plate, a buffer frame, and a display module. The housing body defines a receiving opening and forms an inner peripheral wall. The housing body is formed around a peripheral wall of the support plate for covering one side of the receiving opening. The buffer frame is formed around the inner peripheral wall of the housing body. The display module is received in the receiving opening and is supported by the support plate. The buffer frame abuts against four sides of the display module.
Claims4
A device housing comprising:
- a housing body defining a receiving opening with an inner peripheral wall;
- a support plate formed in the housing body for covering one side of the receiving opening;
- a buffer frame formed in the inner peripheral wall of the housing body;
- and
- a display module received in the receiving opening and supported by the support plate;
- wherein the buffer frame abuts against four sides of the display module.
3 more elements
A method for manufacturing a device housing, comprising:
- providing a support plate made of metal
- injecting a first molten material into a first die chamber of an injection mold to form a housing body bonded to the support plate;
- injecting a second molten material into a second die chamber of the injection mold to form a buffer frame bonded to the housing body.
Dependencies are inferred from the claim text.