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US 2015/0029689 A1Published application
Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method
AssigneeShinko Electric Industries Co., Ltd.
InventorsKei IMAFUJI, Katsumi YAMAZAKI, Noritaka KATAGIRI, Teruaki CHINO
Life of this patent
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Abstract
A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of the cylindrical portion of the metal layer is opened wide.
Claims7
A bump structure provided on an electrode pad, comprising:
- a solder member;
- and
- a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member, wherein
- an upper part of the cylindrical portion of the metal layer is opened wide.
1 more element
A wiring substrate comprising:
- an electrode pad;
- and
- a bump structure provided on the electrode pad, the bump structure including a solder member, and a metal layer which has a cylindrical portion covering a side surface of the solder member and is made of a metal higher in melting point than the solder member, wherein
- an upper part of the cylindrical portion of the metal layer is opened wide.
1 more element
A semiconductor apparatus comprising:
- a wiring substrate having an electrode pad and a bump structure provided on the electrode pad, the bump structure including a solder member and a metal layer which has a cylindrical portion covering a side surface of the solder member and is made of a metal higher in melting point than the solder member, an upper part of the cylindrical portion of the metal layer being opened wide;
- and
- a semiconductor chip mounted on the wiring substrate, and configured to have an electrode that is connected to the bump structure.
Dependencies are inferred from the claim text.