Circuit board, production method of circuit board, and electronic equipment

A circuit board, comprising:

• a plurality of plate structures, each containing:
• a cured insulating material;
• a first metal layer in the form of a pattern, formed on one surface of the insulating material;
• and
• an electroconductive paste, loaded in a hole formed in the insulating material and reaching the first metal layer from a surface of the plate structure opposite to a surface thereof at which the first metal layer has been formed,
• wherein the first metal layer is embedded in the insulating material in the plate structure, and one surface of the first metal layer and one surface of the insulating material are on an identical plane, and
• wherein, among the plurality of the plate structures, a first plate structure filled with the electroconductive paste and a second plate structure filled with the electroconductive plate are provided in a manner that the first metal layer of the first plate structure faces an opening of the hole of the second plate structure.

A circuit board, comprising:

• a plurality of plate structures, each containing:
• a cured insulating material;
• a first metal layer in the form of a pattern formed on one surface of the insulating material;
• and
• a via formed in the insulating material, where the via reaches the first metal layer from a surface of the insulating material opposite to a surface thereof, at which the first metal layer has been formed,
• wherein the first metal layer is embedded in the insulating material in the plate structure, and one surface of the first metal layer and one surface of the insulating material are on an identical plane, and
• wherein, among the plurality of the plate structures, a first plate structure containing the via and a second plate structure containing the via are provided in a manner that the first metal layer of the first plate structure faces an opening of a via of the second plate structure.