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US 2015/0029678 A1Published application
Substrateless device and the method to fabricate thereof
AssigneeCyntec Co., Ltd.
InventorsBAU-RU LU, MING-CHIA WU
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Abstract
A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.
Claims20
A substrateless device, comprising:
- a plurality of first conductive elements;
- and
- an encapsulant encapsulating the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant;
- and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.
1 more element
A method of forming a substrateless device, the method comprising the steps of:
- a. providing a plurality of first conductive elements;
- and
- b. forming an encapsulant to encapsulate the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant;
- and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.
1 more element
Dependencies are inferred from the claim text.