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US 2015/0029677 A1Published application
Multilayer wiring substrate, method of producing the same, and semiconductor product
AssigneeSony Corporation
InventorsToshiyuki INAOKA, Atsuhiro URATSUJI
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Abstract
There is provided a multilayer wiring substrate, including: a trench produced at one surface of an insulation layer, the trench having a depth shallower than a thickness of the insulation layer; and a copper plating applied to the trench. Also, there are provided a method of producing the multilayer wiring substrate, and a semiconductor product including the multilayer wiring substrate.
Claims11
A multilayer wiring substrate, comprising:
- a trench produced at one surface of an insulation layer, the trench having a depth shallower than a thickness of the insulation layer;
- and
- a copper plating applied to the trench.
A method of producing a multilayer wiring substrate, comprising:
- producing a trench having a depth shallower than a thickness of an insulation layer on one surface of the insulation layer;
- and
- applying a copper plating to the trench produced on the insulation layer.
A semiconductor product, comprising:
- a multilayer wiring substrate, having:
- a trench produced at one surface of an insulation layer, the trench having a depth shallower than a thickness of the insulation layer;
- and
- a copper plating applied to the trench.
1 more element
Dependencies are inferred from the claim text.