Printed circuit board set having high-efficiency heat dissipation

Abstract

A printed circuit board set having high-efficiency heat dissipation includes a printed circuit board (PCB) and a heat dissipating device. The PCB has multiple electronic elements, at least one heat dissipating hole, and at least one thermally conductive material. The electronic elements are disposed on the top surface of the PCB. Each of the at least one heat dissipating hole is formed through the top and bottom surfaces of the PCB and aligns with one of the electronic elements. Each of the at least one thermally conductive material is disposed in the corresponding heat dissipating hole and in contact with the corresponding electronic element. The heat dissipating device is attached to the bottom surface of the PCB and in contact with the at least one thermally conductive material. With a high thermal conductivity, the at least one thermally conductive material rapidly transfers the waste heat produced by the PCB in operation to the heat dissipating device for heat dissipation.

Dependencies are inferred from the claim text.