System for cooling an integrated circuit within a computing device

A system for cooling an electrical component within a computing device including a digital display, the system comprising:

• an internal heatsink thermally coupled to the electrical component and defining a fluid passage comprising a first end and a second end;
• a heat exchange layer arranged over the digital display, comprising a transparent material, defining a first fluid channel cooperating with the internal heatsink to define a first fluid circuit, and defining a second fluid channel cooperating with the internal heatsink to define a second fluid circuit;
• a transparent fluid;
• and
• a displacement device configured to circulate the transparent fluid within the first circuit in response to detected orientation of the computing device in a first position and to circulate the transparent fluid within the second circuit in response to detected orientation of the computing device in a second position.

A system for cooling an integrated circuit within a computing device, the system comprising:

• an internal heatsink thermally coupled to the integrated circuit and defining a fluid passage comprising a first end and a second end;
• a heat exchange layer arranged across an external surface of the computing device, and defining a fluid channel, the fluid channel comprising a fluid inlet coupled to the first end of the fluid passage and a fluid outlet coupled to the second end of the fluid passage;
• a fluid;
• and
• a displacement device configured to circulate the fluid between the internal heatsink and the fluid channel.