Radio communication module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsGye Won LEE, Yeong Yeol JO
Life of this patent
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Abstract
Disclosed herein is a radio communication module, including: a printed circuit board provided with a receiving unit receiving a radio wave and provided with a via hole; an antenna including a connector which has a transmitting unit connected to the receiving unit formed thereat and forms a ring part outwardly bent at a tip thereof and forms a cut part at a circumference thereof so that the ring part is elastically deformed so as to be inserted and fastened into the via hole; a ground GND formed on the printed circuit board; and a discharge unit disposed between the receiving unit and the ground and including an ESD diode and a discharge line guiding electrostatic discharge (ESD) introduced from the outside to the ground.
Claims11
A radio communication module, comprising:
- a printed circuit board provided with a receiving unit receiving a radio wave and provided with a via hole;
- an antenna including a connector which has a transmitting unit connected to the receiving unit formed thereat and forms a ring part outwardly bent at a tip thereof and forms a cut part at a circumference thereof so that the ring part is elastically deformed so as to be inserted and fastened into the via hole;
- a ground GND formed on the printed circuit board;
- and
- a discharge unit disposed between the receiving unit and the ground and including an ESD diode and a discharge line guiding electrostatic discharge (ESD) introduced from the outside to the ground.
A radio communication module, comprising:
- a printed circuit board provided with a receiving unit receiving a radio wave and provided with a via hole;
- an antenna including a connector which has a transmitting unit connected to the receiving unit formed thereat and forms a ring part outwardly bent at a tip thereof and forms a cut part at a circumference thereof so that the ring part is elastically deformed so as to be inserted and fastened into the via hole;
- a ground GND formed on the printed circuit board;
- and
- a discharge unit disposed between the receiving unit and the ground and including a discharge inducing unit and a discharge line guiding electrostatic discharge (ESD) or surge introduced from the outside to the ground.
Dependencies are inferred from the claim text.