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US 2015/0028984 A1Published application
Thin film type inductor and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorYoung-Sik KANG
Life of this patent
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Abstract
Disclosed herein is a thin film type inductor having a coil wiring of a high aspect ratio, including: a substrate on which a through hole of a coil pattern is formed; and a metal layer filled in the through hole.
Claims19
A thin film type inductor, comprising:
- a substrate on which a through hole of a coil pattern is formed;
- and
- a metal layer filled in the through hole.
A thin film type inductor, comprising:
- a substrate having at least two layers which is provided with a through hole of a coil pattern and is multilayered in a thickness direction;
- and
- a metal layer filled in the through holes of each layer,
- wherein the metal layers of each layer form one coil wiring by matching patterns thereof on upper and lower portions.
1 more element
A method of manufacturing a thin film type inductor, comprising:
- forming a through hole of a coil pattern on a substrate;
- and
- forming a metal layer in the through hole.
A method of manufacturing a thin film type inductor, comprising:
- forming a groove of a coil pattern on a substrate having a predetermined thickness;
- forming a metal layer in the groove:
- and
- removing a lower portion of the substrate corresponding to a dummy part so as to expose a lower surface of the metal layer.
1 more element
Dependencies are inferred from the claim text.