Package structure for duplexer, method of manufacturing the same and electronic device with the same
AssigneeAmbit Microsystems (Zhongshan) Ltd.
InventorXIAO-YA GUO
Life of this patent
Estimating the term…
Abstract
A package structure includes a printed circuit board (PCB), a duplexer, a first dam, a second dam and a cover. The duplexer includes a transmission filter and a reception filter and is electrically connected with the PCB. The first dam is located on a surface of the PCB, and in cooperation with the PCB forms a first receptacle receiving the transmission filter. The second dam is located on the surface of the PCB, and in cooperation with the PCB forms a second receptacle receiving the reception filter. The cover is fixed with top parts of the first dam and the second dam to seal the transmission filter and the reception filter. A method of manufacturing plural such package structures is also provided.
Claims16
A package structure, comprising:
- a printed circuit board (PCB) for supporting electronic elements assembled thereon;
- a duplexer comprising a transmission filter and a reception filter each electrically connected with the PCB;
- a first dam located on a surface of the PCB, wherein the first dam and the PCB cooperatively form a first receptacle, and the first receptacle has the transmission filter received therein;
- a second dam located on the surface of the PCB, wherein the second dam and the PCB cooperatively form a second receptacle, and the second receptacle has the reception filter received therein;
- and
- a cover covering the first receptacle and the second receptacle and thereby sealing the transmission filter and the reception filter in the first and second receptacles.
A method of manufacturing package structures, the method comprising:
- forming a plurality of pads on a printed circuit board (PCB);
- fixing a plurality of transmission filters and a plurality of reception filters on the pads, thereby electrically connecting the transmission filters and the reception filters with the PCB via the pads;
- forming a plurality of first dams and a plurality of second dams on the PCB;
- fixing a cover on top parts of the first dams and the second dams to form a package body;
- and
- cutting the package body into a plurality of individual package structures.
An electronic device, comprising:
- a housing;
- and
- a package structure located in the housing, the package structure comprising:
- a printed circuit board (PCB) for supporting electronic elements assembled thereon;
- a duplexer comprising a transmission filter and a reception filter each electrically connected with the PCB;
- a first dam located on a surface of the PCB, wherein the first dam and the PCB cooperatively form a first receptacle, and the first receptacle has the transmission filter received therein;
- a second dam located on the surface of the PCB, wherein the second dam and the PCB cooperatively form a second receptacle, and the second receptacle has the reception filter received therein;
- and
- a cover covering the first receptacle and the second receptacle and thereby sealing the transmission filter and the reception filter in the first and second receptacles.
Dependencies are inferred from the claim text.