Apparatus and Method for Forming Alignment Features for Back Side Processing of a Wafer
AssigneeAnalog Devices, Inc.
InventorsChristine H. Tsau, William David Sawyer, Thomas Kieran Nunan
Life of this patent
Estimating the term…
Abstract
A method for forming an alignment feature for back side wafer processing in a wafer fabrication process involves forming a trench into but not entirely through a wafer from a top side of the wafer; forming a contrasting material on surfaces of the trench; and grinding a bottom side of the wafer to expose the trench using the handling wafer to handle the wafer during such grinding, wherein the contrasting material lining the exposed trench provides an alignment reference for precise alignment of the wafer for back side processing the wafer.
Claims20
A method for forming an alignment feature for back side wafer processing in a wafer fabrication process, the method comprising:
- forming a trench into but not entirely through a wafer from a top side of the wafer;
- forming a contrasting material on surfaces of the trench;
- and
- grinding a bottom side of the wafer to expose the trench, wherein the contrasting material lining the exposed trench provides an alignment reference for precise alignment of the wafer for back side processing the wafer.
Apparatus comprising a wafer having a trench formed from a top side of the wafer and lined with a contrasting material, the trench exposed from a bottom side of the wafer, wherein the contrasting material provides an alignment reference for precise alignment of the wafer by an alignment tool for back side processing the wafer.
Dependencies are inferred from the claim text.