Method for manufacturing a conducting contact on a conducting element

A method for producing an interconnection pad on a conducting element comprising an upper face and a side wall;

• the method being executed from a substrate at least the upper face of which is insulating;
• the conducting element going through at least an insulating portion of the substrate, the method comprising the sequence of the following steps:
• a step of embossing the conducting element, so configured that the conducting element protrudes beyond the insulating upper face of the substrate,
• a step of forming, above the upper insulating face of the substrate, a stack of layers comprising at least one electrically conducting layer and one electrically resistive layer, with said electrically resistive layer having a higher resistivity than that of the electrically conducting layer,
• a step of partially stripping the electrically resistive layer, so configured as to reveal at least an access to the electrically conducting layer, said access being positioned above the protruding conducting element;
• said step comprising polishing said electrically resistive layer,
• a step of electrolytic growth on the portion of the electrically conducting layer, said conducting layer being positioned above the conducting element, so as to form at least one interconnection pad on said conducting element.