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US 2015/0028487 A1Published application
Chip Package with Passives
AssigneeInfineon Technologies AG
InventorsGeorg Meyer-Berg, Joachim Mahler, Khalil Hosseini
Life of this patent
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Abstract
A chip package device includes an electrically conducting chip carrier, at least one semiconductor chip attached to the electrically conducting chip carrier, and an insulating laminate structure embedding the chip carrier, the at least one semiconductor chip and a passive electronic device. The passive electronic device includes a first structured electrically conducting layer, the first structured electrically conducting layer extending over a surface of the laminate structure.
Claims22
A chip package, comprising:
- an electrically conducting chip carrier;
- at least one semiconductor chip attached to the electrically conducting chip carrier;
- an insulating laminate structure embedding the electrically conducting chip carrier and the at least one semiconductor chip;
- and
- a passive electronic device comprising a first structured electrically conducting layer, wherein the first structured electrically conducting layer extends directly on a surface of the laminate structure.
2 more elements
A chip package, comprising:
- an electrically conducting chip carrier;
- at least one semiconductor chip attached to the electrically conducting chip carrier;
- an insulating layer extending over the electrically conducting chip carrier;
- a passive electronic device comprising a first structured electrically conducting layer, wherein the first structured electrically conducting layer extends over the insulating layer;
- and
- an insulating laminate structure embedding the electrically conducting chip carrier, the at least one semiconductor chip, and the passive electronic device.
3 more elements
Dependencies are inferred from the claim text.