Interconnect structures for embedded bridge

A package assembly comprising:

• a bridge interconnect structure including a die contact that is configured to route electrical signals between a first die and a second die;
• an electrically insulative layer disposed on the bridge interconnect structure;
• and
• a die interconnect of the first die or the second die disposed on and electrically coupled with the die contact, the die interconnect including a pillar structure that extends through the electrically insulative layer and protrudes beyond a surface of the electrically insulative layer.

A computing device comprising:

• a package assembly including
• a bridge interconnect structure including a first die contact and a second die contact that are configured to route electrical signals between a first die and a second die,
• an electrically insulative layer disposed on the bridge interconnect structure,
• a first die interconnect disposed on and electrically coupled with the first die contact,
• a second die interconnect disposed on and electrically coupled with the second die contact,
• the first die coupled with the first die interconnect, and
• the second die coupled with the second die interconnect, wherein the first die interconnect and the second die interconnect each include a pillar structure that extends through the electrically insulative layer and protrudes beyond a surface of the electrically insulative layer;
• and
• a circuit board coupled with the circuit board using package interconnects.