Substrate structure and semiconductor package having the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsLiang-Yi Hung, Shih-Chao Chih, Yu-Cheng Pai, Wei-Chung Hsiao
Life of this patent
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Abstract
A substrate structure is provided. The substrate structure includes a substrate body; a metal layer formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having at least an opening for exposing the metal layer; and at least a die attach area defined on the surface of the substrate body corresponding in position to the opening for a semiconductor chip to be disposed thereon. The die attach area covers the entire opening or the metal layer is formed within the die attach area, thereby effectively preventing package delamination and improving the product yield.
Claims13
A substrate structure, comprising:
- a substrate body;
- a metal layer formed on a surface of the substrate body;
- an insulating layer formed on the surface of the substrate body and having at least an opening exposing the metal layer;
- and
- at least a die attach area defined on the surface of the substrate body corresponding in position to the opening for a semiconductor chip to be disposed thereon, wherein the die attach area covers whole the opening or the metal layer is formed within the die attach area.
A semiconductor package, comprising:
- a substrate body;
- a metal layer formed on a surface of the substrate body;
- an insulating layer formed on the surface of the substrate body and having at least an opening exposing the metal layer;
- and
- at least a semiconductor chip disposed on the metal layer corresponding in position to the opening, wherein a projection of the semiconductor chip on the surface of the substrate body covers whole the opening or the metal layer is formed within the projection of the semiconductor chip on the surface of the substrate body.
Dependencies are inferred from the claim text.