Semiconductor devices with ball strength improvement
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Yuan YU, Hsien-Wei CHEN, Ying-Ju CHEN, Shih-Wei LIANG
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Abstract
A semiconductor device includes a contact region over a substrate. The semiconductor device further includes a metal pad over the contact region. Additionally, the semiconductor device includes a post passivation interconnect (PPI) line over the metal pad, where the PPI line is in contact with the metal pad. Furthermore, the semiconductor device includes an under-bump-metallurgy (UBM) layer over the PPI line. Moreover, the semiconductor device includes a plurality of solder balls over the UBM layer, the plurality of solder balls being arranged at some, but not all, intersections of a number of columns and rows of a ball pattern.
Claims20
A semiconductor device, comprising:
- a contact region over a substrate;
- a metal pad over the contact region;
- a post passivation interconnect (PPI) line over the metal pad, wherein the PPI line is in contact with the metal pad;
- an under-bump-metallurgy (UBM) layer over the PPI line;
- and
- a plurality of solder balls over the UBM layer, the plurality of solder balls being arranged at some, but not all, intersections of a number of columns and rows of a ball pattern.
A semiconductor device, comprising:
- a contact region over a substrate;
- a metal pad over the contact region, wherein the metal pad is in contact with the contact region;
- a post passivation interconnect (PPI) line over the metal pad;
- a polymer layer over the PPI line;
- an under-bump-metallurgy (UBM) layer over the polymer layer;
- and
- a plurality of solder balls over the UBM layer, the plurality of solder balls being arranged at some, but not all, intersections of a number of columns and rows of a ball pattern, wherein, at least in corner regions of the chip, each solder ball among the plurality of solder balls has at least two neighboring solder balls among the plurality of solder balls.
A semiconductor device with improved ball strength, said semiconductor device comprising:
- a chip having an active surface;
- a plurality of connection balls on the active surface and in electrical connection with the chip, said connection balls being arranged at some, but not all, intersections of a number of columns and rows of a ball pattern;
- and
- a plurality of dummy balls on the active surface but not in electrical connection with the chip, said dummy balls being arranged at intersections where the connection balls are not arranged;
- wherein, at least in corner regions of the chip, every connection ball of the plurality of connection balls or dummy ball of the plurality of dummy balls has at least two neighboring connection balls or dummy balls.
Dependencies are inferred from the claim text.