Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs
AssigneeMicron Technology, Inc.
InventorsKyle K. Kirby, Kunal R. Parekh
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Abstract
Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming one or more openings in a front side of the semiconductor device and forming sacrificial plugs in the openings that partially fill the openings. The method further includes further filling the partially filled openings with a conductive material, where individual sacrificial plugs are generally between the conductive material and a substrate of the semiconductor device. The sacrificial plugs are exposed at a backside of the semiconductor device. Contact regions can be formed at the backside by removing the sacrificial plugs.
Claims5
A semiconductor device, comprising:
- a substrate having an opening extending from a front side of the substrate to a backside of the substrate;
- and
- a through-substrate via that extends through the opening, wherein the thorough-substrate via includes:
- a first conductive material extending through the opening at the front side of the substrate;
- a second conductive material extending through the opening at the backside of the substrate;
- and
- at least one barrier/seed material between the first conductive material and the second conductive material.
Dependencies are inferred from the claim text.