Semiconductor device and method for manufacturing the same

A semiconductor device comprising:

• two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface;
• an electrode plate that includes a first lead terminal and a bonding portion which is formed on one surface and is bonded to the first main surfaces of the two or more semiconductor elements, with a first bonding material layer interposed therebetween;
• and
• a conductive plate that includes a second lead terminal and a semiconductor element bonding portion which is bonded to the second main surfaces of the two or more semiconductor elements, with a second bonding material layer interposed therebetween,
• wherein the semiconductor elements are arranged such that a longitudinal direction thereof is parallel to the second lead terminal.

A semiconductor device comprising:

• two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface;
• an electrode plate that includes a bonding portion which is formed on one surface and is bonded to the first main surfaces of the two or more semiconductor elements, with a first bonding material layer interposed therebetween, and extends from the bonding portion through a bent portion;
• a conductive plate that includes a first lead terminal and a semiconductor element bonding portion which is bonded to the second main surfaces of the semiconductor elements, with a second bonding material layer interposed therebetween, and is connected to the second main surfaces of the two or more semiconductor elements;
• and
• a second lead terminal that is bonded to the connection portion of the electrode plate, with a third bonding material layer interposed therebetween,
• wherein the semiconductor elements are arranged such that a longitudinal direction thereof is parallel to the first lead terminal.

A semiconductor device comprising:

• two or more semiconductor elements, each of which has electrodes on a first main surface and a second main surface and is arranged such that a longitudinal direction thereof is parallel to an injection direction of a molding resin sealing;
• an electrode plate that includes a first lead terminal and a bonding portion which is formed on one surface, is bonded to the first main surfaces of the two or more semiconductor elements, with a first bonding material layer interposed therebetween, extends over the first main surfaces of the semiconductor elements, and has convex portions formed in bonding portions to the first main surfaces of the semiconductor elements;
• and
• a conductive plate that includes a second lead terminal and a semiconductor element bonding portion which is bonded to the two or more semiconductor elements, with a second bonding material layer interposed therebetween.