Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus

A lead frame, comprising:

• a first island and a second island that are arranged side by side via a predetermined space in a first direction;
• an outer peripheral frame;
• a plurality of first leads that extend in a second direction perpendicular to the first direction such that the first leads are arranged side by side in the first direction, wherein each of the first leads has an external connection end at one end in the second direction and a semiconductor element connection end for connecting to a semiconductor element at the other end in the second direction;
• a plurality of second leads that extend in the second direction such that the second leads are arranged side by side in the first direction, wherein each of the second leads has an external connection end at one end in the second direction and a semiconductor element connection end for connecting to a semiconductor element at the other end in the second direction;
• a first coupling portion that couples the first leads to the outer peripheral frame such that the first coupling portion crosses the first leads;
• a second coupling portion that couples the second leads to the outer peripheral frame such that the second coupling portion crosses the second leads;
• an intermediate portion that is formed between the first and second coupling portions in the first direction such that the intermediate portion couples the first coupling portion to the second coupling portion, wherein the intermediate portion extends in the second direction to terminate before the predetermined space between the first and second islands;
• and
• a deformation restraining portion configured to restrain deformations of the first and second leads during a molding process, wherein the deformation restraining portion is formed or provided in at least one of the first leads, the second leads, the first coupling portion and the second coupling portion.