Integrated Passives Package, Semiconductor Module and Method of Manufacturing
AssigneeInfineon Technologies AG
InventorChee Yang Ng
Life of this patent
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Abstract
An integrated passives package includes an encapsulation compound and a plurality of electrically conductive pads embedded in the encapsulation compound. Each of the pads has opposing first and second sides. The first side of the pads is uncovered by the encapsulation compound and forms array of external electrical connections at a first side of the package. The integrated passives package further includes a plurality of passive components embedded in the encapsulation compound. Each of the passive components has a first terminal attached to one of the pads and a second terminal attached to a different one the pads at the second side of the pads. Corresponding semiconductor modules and methods of manufacturing are also provided.
Claims21
An integrated passives package, comprising:
- an encapsulation compound;
- a plurality of electrically conductive pads embedded in the encapsulation compound, each of the pads having opposing first and second sides, the first side of the pads being uncovered by the encapsulation compound and forming an array of external electrical connections at a first side of the package;
- and
- a plurality of passive components embedded in the encapsulation compound, each of the passive components having a first terminal attached to one of the pads and a second terminal attached to a different one the pads at the second side of the pads.
A method of manufacturing an integrated passives package, the method comprising:
- providing a plurality of electrically conductive pads and a plurality of passive components, each pad having opposing first and second sides and each passive component having first and second terminals;
- attaching the first terminal of each passive component to one of the pads and the second terminal to a different one the pads at the second side of the pads;
- embedding the pads and the passive components in an encapsulation compound so that the first side of the pads are uncovered by the encapsulation compound;
- and
- separating groups of the pads and passive components into discrete integrated passives packages, each integrated passives package having an array of external electrical connections at a side of the package formed by the first side of the pads included in the package.
A semiconductor module, comprising:
- an integrated passives package comprising:
- a plurality of electrically conductive pads embedded in an encapsulation compound, each of the pads having opposing first and second sides, the first side of the pads being uncovered by the encapsulation compound and forming an array of external electrical connections at a first side of the integrated passives package;
- and
- a plurality of passive components embedded in the encapsulation compound, each of the passive components having a first terminal attached to one of the pads and a second terminal attached to a different one the pads at the second side of the pads;
- and
- a semiconductor die electrically connected to at least some of the external electrical connections at the first side of the integrated passives package.
A method of manufacturing a semiconductor module, the method comprising;
- providing an integrated passives package comprising:
- a plurality of electrically conductive pads embedded in an encapsulation compound, each of the pads having opposing first and second sides, the first side of the pads being uncovered by the encapsulation compound and forming an array of external electrical connections at a first side of the integrated passives package;
- and
- a plurality of passive components embedded in the encapsulation compound, each of the passive components having a first terminal attached to one of the pads and a second terminal attached to a different one the pads at the second side of the pads;
- and
- electrically connecting a semiconductor die to at least some of the external electrical connections at the first side of the integrated passives package.
Dependencies are inferred from the claim text.