Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorsAkane HASEGAWA, Kenji OKAMOTO
Life of this patent
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Abstract
A semiconductor module includes: a metal block; an insulation layer for heat radiation formed by directly depositing a ceramic material on at least a first surface of the metal block; an insulation layer for a relay electrode formed by directly depositing a ceramic material on a part of a second surface 1b of the metal block; a relay electrode formed by depositing a metal material on the upper surface of the insulation layer for the relay electrode; a circuit element bonded with the second surface of the metal block by solder; and an external lead terminal, wherein a bonding wire or a lead frame from the circuit element is bonded with the relay electrode, and the relay electrode and the external lead terminal are connected.
Claims20
A semiconductor module, comprising:
- a metal block that has a first surface and a second surface;
- an insulation layer for heat radiation formed by directly depositing a ceramic material on at least the first surface of the metal block;
- an insulation layer for a relay electrode, formed by directly depositing a ceramic material on a part of the second surface of the metal block;
- a relay electrode formed by depositing a metal material on an upper surface of the insulation layer for the relay electrode;
- a circuit element bonded with the second surface of the metal block;
- and
- an external lead terminal, wherein
- a bonding wire or a lead frame from the circuit element is bonded with the relay electrode, and
- the relay electrode and the external lead terminal are connected.
A semiconductor device, comprising:
- a block;
- a circuit element on the block;
- a relay element on the block;
- and
- an external lead terminal;
- wherein the circuit element is connected to the external lead terminal via the relay element.
Dependencies are inferred from the claim text.