Conductive Pads and Methods of Formation Thereof

A method of forming a device, the method comprising:

• forming a first conductive pad and a second conductive pad over a substrate;
• forming a etch stop layer over the first conductive pad and the second conductive pad;
• forming a solder layer over the etch stop layer;
• removing the solder layer from over the first conductive pad using a first etch process;
• and
• removing the etch stop layer from over the first conductive pad using a second etch process, wherein the second etch process selectively removes the etch stop layer relative to the underlying first conductive pad.

A method of forming a device, the method comprising:

• providing a first conductive pad disposed over a substrate;
• forming an etch stop layer over a top surface of the first conductive pad;
• and
• forming a solder layer over the etch stop layer.

A method of forming a device, the method comprising:

• stacking a first substrate and a second substrate;
• wire bonding a first conductive pad on the second substrate;
• and
• soldering a connector to a second conductive pad on the second substrate, wherein a etch stop layer is disposed between the connector and the second conductive pad.