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US 2015/0028448 A1Published application
Chip Package with Embedded Passive Component
AssigneeInfineon Technologies AG
InventorsKhalil Hosseini, Joachim Mahler, Georg Meyer-Berg
Life of this patent
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Abstract
A chip package includes an electrically conducting chip carrier and at least one first semiconductor chip attached to the electrically conducting chip carrier. The chip package further includes a passive component. The electrically conducting chip carrier, the at least one first semiconductor chip, and the passive component are embedded in an insulating laminate structure.
Claims25
A chip package, comprising:
- an electrically conducting chip carrier;
- at least one first semiconductor chip attached to the electrically conducting chip carrier;
- a passive component;
- and
- an insulating laminate structure embedding the electrically conducting chip carrier, the at least one first semiconductor chip, and the passive component.
2 more elements
A chip package, comprising:
- a passive component;
- a metal layer covering at least partially at least one main surface of the passive component;
- at least one first semiconductor chip attached to the metal layer;
- and
- an insulating laminate structure embedding the passive component and the at least one first semiconductor chip.
2 more elements
A method of fabricating a chip package, comprising:
- mounting a second semiconductor chip and a passive component on one another to provide for a stacked device;
- mounting at least one first semiconductor chip onto an electrically conducting chip carrier;
- and
- laminating an electrically insulating layer over the electrically conducting chip carrier, the at least one first semiconductor chip, and the stacked device.
1 more element
Dependencies are inferred from the claim text.