Method of Packaging Integrated Circuits and a Molded Package
AssigneeInfineon Technologies AG
InventorsUlrich Wachter, Dominic Maier, Thomas Kilger
Life of this patent
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Abstract
A method of packaging integrated circuits includes providing a molded substrate that has a plurality of first semiconductor dies and a plurality of second semiconductor dies laterally spaced apart from one another and covered by a molding compound. The molding compound is thinned to expose at least some of the second semiconductor dies. The exposed second semiconductor dies are removed to form cavities in the molded substrate. A plurality of third semiconductor dies are inserted in the cavities formed in the molded substrate, and electrical connections are formed to the first semiconductor dies and to the third semiconductor dies.
Claims20
A method of packaging integrated circuits, the method comprising:
- providing a molded substrate including a plurality of first semiconductor dies and a plurality of second semiconductor dies laterally spaced apart from one another and covered by a molding compound;
- thinning the molding compound to expose at least some of the second semiconductor dies;
- removing the exposed second semiconductor dies to form cavities in the molded substrate;
- inserting a plurality of third semiconductor dies in the cavities formed in the molded substrate;
- and
- forming electrical connections to the first semiconductor dies and to the third semiconductor dies.
A method of packaging an integrated circuit, the method comprising:
- providing a molded substrate including a semiconductor die and a placeholder laterally spaced apart from one another and covered by a molding compound;
- thinning the molding compound to expose the placeholder;
- removing the exposed placeholder to form a cavity in the molded substrate;
- inserting a silicon microphone in the cavity formed in the molded substrate;
- and
- forming electrical connections to the semiconductor die and to the silicon microphone.
A molded package, comprising:
- a semiconductor die embedded in a molding compound and having a side uncovered by the molding compound;
- a cavity formed in the molding compound;
- a silicon microphone disposed in the cavity so that the silicon microphone is not embedded in the molding compound;
- an insulation layer on the same side of the molding compound as the side of the semiconductor die which is uncovered by the molding compound;
- and
- a metal layer contacting pads of the semiconductor die and the silicon microphone through openings in the insulation layer.
Dependencies are inferred from the claim text.