Encapsulation structure including a mechanically reinforced cap and with a getter effect

A method of encapsulation of at least one microdevice, including at least the following steps:

• production of the microdevice on and/or in a substrate;
• production of mechanical reinforcement portions rigidly attached to at least one face of a layer of a first material, partly covering the said face of the layer of the first material, and having gas absorption and/or adsorption properties, where the layer of the first material and the mechanical reinforcement portions form a cap;
• rigid attachment of the cap to the substrate such that the microdevice is encapsulated in a cavity formed between the cap and the substrate;
• and in which the mechanical reinforcement portions include at least one second material, the Young's modulus of which is higher than that of the first material.

A method of encapsulation of at least one microdevice, including at least the following steps:

• production of the microdevice on and/or in a substrate;
• production of a portion of sacrificial material at least on the microdevice and such that the volume occupied by the portion of sacrificial material is equal to at least one part of a volume of a cavity in which the microdevice is intended to be encapsulated;
• production of mechanical reinforcement portions on and/or in the portion of sacrificial material and having gas absorption and/or adsorption properties;
• deposition of a layer of a first material covering at least the mechanical reinforcement portions and the portion of sacrificial material;
• etching of the portion of sacrificial material, forming the cavity in which the microdevice is encapsulated;
• and in which the mechanical reinforcement portions include at least one second material, the Young's modulus of which is higher than that of the first material.